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GLVLSI
2003
IEEE
180views VLSI» more  GLVLSI 2003»
14 years 22 days ago
3D direct vertical interconnect microprocessors test vehicle
The current trends in high performance integrated circuits are towards faster and more powerful circuits in the giga-hertz range and even further. As the more complex Integrated C...
John Mayega, Okan Erdogan, Paul M. Belemjian, Kuan...
BROADNETS
2006
IEEE
14 years 1 months ago
SeeMote: In-Situ Visualization and Logging Device for Wireless Sensor Networks
In this paper we address three challenges that are present when building and analyzing wireless sensor networks (WSN) as part of ubiquitous computing environment: the need for an ...
Leo Selavo, Gang Zhou, John A. Stankovic
GLVLSI
2008
IEEE
204views VLSI» more  GLVLSI 2008»
14 years 1 months ago
NBTI resilient circuits using adaptive body biasing
Reliability has become a practical concern in today’s VLSI design with advanced technologies. In-situ sensors have been proposed for reliability monitoring to provide advance wa...
Zhenyu Qi, Mircea R. Stan
BSN
2009
IEEE
141views Sensor Networks» more  BSN 2009»
14 years 2 months ago
Low-Complexity, High-Throughput Multiple-Access Wireless Protocol for Body Sensor Networks
Wireless systems that form a body-area network must be made small and low power without sacrificing performance. To achieve high-throughput communication in low-cost wireless bod...
Seung-mok Yoo, Chong-Jing Chen, Pai H. Chou
ICRA
2003
IEEE
146views Robotics» more  ICRA 2003»
14 years 22 days ago
Bundled carbon nanotubes as electronic circuit and sensing elements
- Bundled multi-walled carbon nanotubes (MWNT) were successfully and repeatably manipulated by AC electrophoresis to form resistive elements between Au microelectrodes and were dem...
Victor T. S. Wong, Wen J. Li