3379 search results - page 120 / 676 » Powers of Two |
169
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TCAD
2011
14 years 11 months ago
2011
—Pre-bond testing of 3-D stacked integrated circuits (ICs) involves testing each individual die before bonding. The overall yield of 3-D ICs improves with pre-bond testability be...
152
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INFOCOM
2012
IEEE
13 years 6 months ago
2012
IEEE
—Power optimization has become a key challenge in the design of large-scale enterprise data centers. Existing research efforts focus mainly on computer servers to lower their ene...
121
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MOBIHOC
2005
ACM
16 years 4 months ago
2005
ACM
Recently, several studies have analyzed the statistical properties of low power wireless links in real environments, clearly demonstrating the differences between experimentally o...
119
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ISPASS
2009
IEEE
15 years 11 months ago
2009
IEEE
In temperature-aware design, the presence or absence of a heatsink fundamentally changes the thermal behavior with important design implications. In recent years, chip-level infra...
150
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MICRO
2008
IEEE
15 years 10 months ago
2008
IEEE
Any architectural optimization aims at satisfying the end user. However, modern architectures execute with little to no knowledge about the individual user. If architectures could...