908 search results - page 143 / 182 » Predictive Performance Modelling of Parallel Component Compo... |
3DIC
2009
IEEE
14 years 2 months ago
2009
IEEE
Abstract—In 3DICs heat dissipating devices are stacked directly on top of each other leading to a higher heat density than in a comparable 2D chip. 3D integration also moves the ...
IPPS
2008
IEEE
14 years 1 months ago
2008
IEEE
SIMD (single instruction multiple data)-type processors have been found very efficient in image processing applications, because their repetitive structure is able to exploit the...
APCSAC
2005
IEEE
14 years 1 months ago
2005
IEEE
In order to enhance the performance of a computer, most modern processors use superscalar architecture and raise the clock frequency. Superscalar architecture can execute more than...
HPDC
2011
IEEE
12 years 11 months ago
2011
IEEE
We investigate proactive dynamic load balancing on multicore systems, in which threads are continually migrated to reduce the impact of processor/thread mismatches to enhance the ...
GLOBECOM
2009
IEEE
14 years 2 months ago
2009
IEEE
— In this paper we evaluate, by means of Extrinsic Information Transfer (EXIT) charts, an iterative receiver that has emerged as a promising candidate for non-coherent multi-user...