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ICCAD
2010
IEEE
13 years 5 months ago
2010
IEEE
In 3D integrated circuits through silicon vias (TSVs) are used to connect different dies stacked on top of each other. These TSV occupy silicon area and have significantly larger a...
CVGIP
2002
13 years 7 months ago
2002
The dual of a 2-manifold polygonal mesh without boundary is commonly defined as another mesh with the same topology (genus) but different connectivity (vertex-face incidence), in ...
GIS
2008
ACM
14 years 8 months ago
2008
ACM
Road network data is often incomplete, making it hard to perform network analysis. This paper discusses the problem of extending partial road networks with reasonable links, using...
PERCOM
2010
ACM
13 years 5 months ago
2010
ACM
In this paper, we explore how to effectively create and use "instant mesh networks", i.e., wireless mesh networks that are dynamically deployed in temporary circumstances...
UAI
2004
13 years 8 months ago
2004
We address the problem of unsupervised learning of complex articulated object models from 3D range data. We describe an algorithm whose input is a set of meshes corresponding to d...