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DAC
2008
ACM
13 years 12 months ago
Keeping hot chips cool: are IC thermal problems hot air?
level of accuracy in IC package abstraction (compact models) to ensure robust thermal design. An overarching goal must be to reduce power consumption per function through smart pro...
Ruchir Puri, Devadas Varma, Darvin Edwards, Alan J...
ICSE
2008
IEEE-ACM
14 years 11 months ago
A case study evaluation of maintainability and performance of persistency techniques
Efforts for software evolution supersede any other part of the software life cycle. Technological decisions have a major impact on the maintainability, but are not well reflected ...
Thomas Goldschmidt, Ralf Reussner, Jochen Winzen
SAFECOMP
1998
Springer
14 years 2 months ago
An Agenda for Specifying Software Components with Complex Data Models
Abstract. We present a method to specify software for a special kind of safetycritical embedded systems, where sensors deliver low-level values that must be abstracted and pre-proc...
Kirsten Winter, Thomas Santen, Maritta Heisel
UIST
1997
ACM
14 years 2 months ago
The MetaDESK: Models and Prototypes for Tangible User Interfaces
The metaDESK is a user interface platform demonstrating new interaction techniques we call “tangible user interfaces.” We explore the physical instantiation of interface eleme...
Brygg Ullmer, Hiroshi Ishii
EMSOFT
2004
Springer
14 years 3 months ago
Reuse of software in distributed embedded automotive systems
Until recently, in the automotive industry, reuse of software has entirely been a typical activity of suppliers. They try to reduce the increasing software development costs that ...
Bernd Hardung, Thorsten Kölzow, Andreas Kr&uu...