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    CORR
    2008
    Springer
    194views Education» more  CORR 2008»
    Fabrication of 3D Packaging TSV using DRIE
    13 years 10 months ago
    Fabrication of 3D Packaging TSV using DRIE
    Download  www.alcatelmicromachining.com
    Emerging 3D chips stacking and MEMS/Sensors packaging technologies are using DRIE (Deep Reactive Ion Etching) to etch Through-Silicon Via (TSV) for advanced interconnections. The ...
    M. Puech, Jean-Marc Thevenoud, J. M. Gruffat, N. L...
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    FDL
    2011
    IEEE
    191views Natural Language Processing» more  FDL 2011»
    Integrating system descriptions by clocked guarded actions
    12 years 9 months ago
    Integrating system descriptions by clocked guarded actions
    Download  www.irisa.fr
    —For the description of reactive systems, there is a large number of languages and formalisms, and depending on a particular application or design phase, one of them may be bette...
    Jens Brandt, Mike Gemunde, Klaus Schneider, Sandee...
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    AINA
    2008
    IEEE
    153views Computer Networks» more  AINA 2008»
    Fortification of IT Security by Automatic Security Advisory Processing
    14 years 4 months ago
    Fortification of IT Security by Automatic Security Advisory Processing
    Download  research.securityresearch.at
    Stefan Fenz, Andreas Ekelhart, Edgar R. Weippl
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    NOCS
    2008
    IEEE
    98views Computer Networks» more  NOCS 2008»
    Impact of Process and Temperature Variations on Network-on-Chip Design Exploration
    14 years 4 months ago
    Impact of Process and Temperature Variations on Network-on-Chip Design Exploration
    Download  async.org.uk
    Bin Li, Li-Shiuan Peh, Priyadarsan Patra
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    ANCS
    2006
    ACM
    88views Computer Networks» more  ANCS 2006»
    Symerton--using virtualization to accelerate packet processing
    14 years 3 months ago
    Symerton--using virtualization to accelerate packet processing
    Download  www.cs.wustl.edu
    Aaron R. Kunze, Stephen D. Goglin, Erik J. Johnson
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