Abstract—A rising horizon in chip fabrication is the 3D integration technology. It stacks two or more dies vertically with a dense, highspeed interface to increase the device den...
Xiuyi Zhou, Jun Yang 0002, Yi Xu, Youtao Zhang, Ji...
In this paper, we consider minimizing the system-level energy consumption through dynamic voltage scaling for embedded devices, while a) allowing concurrent access to shared objec...
The advance in semiconductor technologies presents the serious problem of parameter variations. They affect threshold voltage of transistors and thus circuit delay has variability...
Dynamic voltage scaling (DVS) is a well-known low power design technique that reduces the processor energy by slowing down the DVS processor and stretching the task execution time...
A heterogeneous multi-processor (HeMP) system consists of several heterogeneous processors, each of which is specially designed to deliver the best energy-saving performance for a...