Modern software codebases are frequently large, heterogeneous, and constantly evolving. The languages and tools for software construction, including code builds and configuration m...
Within-die variation in leakage power consumption is substantial and increasing for chip-level multiprocessors (CMPs) and multiprocessor systems-on-chip. Dealing with this problem...
Lide Zhang, Lan S. Bai, Robert P. Dick, Li Shang, ...
3D stacked wafer integration has the potential to improve multiprocessor system-on-chip (MPSoC) integration density, performance, and power efficiency. However, the power density...
The characteristics of ad hoc networks naturally encourage the deployment of distributed services. Although current networks implement group communication methods, they do not sup...
In spite of a relatively large number of publications about breaking Enigma by the Allies before and during the World War II, this subject remains relatively unknown not only to th...