Abstract— Chip-package thermal analysis is necessary for the design and synthesis of reliable, high-performance, low-power, compact integrated circuits (ICs). Many methods of IC ...
Reliability-aware software architecture development has recently been gaining growing attention among software architects. This paper tackles the issue by introducing an ontology-...
This paper presents a layout generation tool that aims to reduce the gap between electrical sizing and physical realization of high performance analog circuits. The procedural lay...
Deep submicron processes have allowed FPGAs to grow in complexity and speed. However, such technology scaling has caused FPGAs to become more susceptible to the effects of process...
This paper presents a systematic design methodology for yield enhancement of asynchronous logic circuits using 3-D (3-Dimensional) integration technology. In this design, the targ...