282 search results - page 15 / 57 » Reliability- and process-variation aware design of integrate... |
ICCAD
2006
IEEE
14 years 6 months ago
2006
IEEE
Abstract— Chip-package thermal analysis is necessary for the design and synthesis of reliable, high-performance, low-power, compact integrated circuits (ICs). Many methods of IC ...
COMPSAC
2008
IEEE
14 years 3 months ago
2008
IEEE
Reliability-aware software architecture development has recently been gaining growing attention among software architects. This paper tackles the issue by introducing an ontology-...
ISQED
2000
IEEE
2000
IEEE
A Layout Approach for Electrical and Physical Design Integration of High-Performance Analog Circuits
14 years 1 months ago
This paper presents a layout generation tool that aims to reduce the gap between electrical sizing and physical realization of high performance analog circuits. The procedural lay...
FPGA
2010
ACM
14 years 6 months ago
2010
ACM
Deep submicron processes have allowed FPGAs to grow in complexity and speed. However, such technology scaling has caused FPGAs to become more susceptible to the effects of process...
GLVLSI
2006
IEEE
14 years 3 months ago
2006
IEEE
This paper presents a systematic design methodology for yield enhancement of asynchronous logic circuits using 3-D (3-Dimensional) integration technology. In this design, the targ...