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DAC
2009
ACM
14 years 10 months ago
Flip-chip routing with unified area-I/O pad assignments for package-board co-design
In this paper, we present a novel flip-chip routing algorithm for package-board co-design. Unlike the previous works that can consider only either free- or pre-assignment routing,...
Jia-Wei Fang, Martin D. F. Wong, Yao-Wen Chang
RECOMB
2004
Springer
14 years 10 months ago
Interface surfaces for protein-protein complexes
Protein-protein interactions, which form the basis for most cellular processes, result in the formation of protein interfaces. Believing that the local shape of proteins is crucia...
Yih-En Andrew Ban, Herbert Edelsbrunner, Johannes ...
ICCAD
2007
IEEE
108views Hardware» more  ICCAD 2007»
14 years 6 months ago
Novel wire density driven full-chip routing for CMP variation control
— As nanometer technology advances, the post-CMP dielectric thickness variation control becomes crucial for manufacturing closure. To improve CMP quality, dummy feature filling ...
Huang-Yu Chen, Szu-Jui Chou, Sheng-Lung Wang, Yao-...
SI3D
2010
ACM
14 years 4 months ago
Parallel Banding Algorithm to compute exact distance transform with the GPU
We propose a Parallel Banding Algorithm (PBA) on the GPU to compute the exact Euclidean Distance Transform (EDT) for a binary image in 2D and higher dimensions. Partitioning the i...
Thanh-Tung Cao, Ke Tang, Anis Mohamed, Tiow Seng T...
NOSSDAV
2009
Springer
14 years 4 months ago
A delaunay triangulation architecture supporting churn and user mobility in MMVEs
This article proposes a new distributed architecture for update message exchange in massively multi-user virtual environments (MMVE). MMVE applications require delivery of updates...
Mohsen Ghaffari, Behnoosh Hariri, Shervin Shirmoha...