487 search results - page 98 / 98 » Routing in Outer Space |
ICCAD
2009
IEEE
13 years 5 months ago
2009
IEEE
Heat removal and power delivery have become two major reliability concerns in 3D stacked IC technology. For thermal problem, two possible solutions exist: thermal-through-silicon-...
JOC
2011
13 years 2 months ago
2011
In light of the growing complexity of cryptographic protocols and applications, it becomes highly desirable to mechanize — and eventually automate — the security analysis of p...