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CORR
2008
Springer
84views Education» more  CORR 2008»
13 years 7 months ago
Novel Bonding technologies for wafer-level transparent packaging of MOEMS
Packaging costs of Micro-Electro-Mechanical System (MEMS) are still contributing with >50% to the total costs of most devices. Aligned wafer bonding techniques for Wafer-level ...
Herwig Kirchberger, Paul Lindler, Markus Wimplinge...
ICRA
2010
IEEE
117views Robotics» more  ICRA 2010»
13 years 6 months ago
Data-driven optimization for underactuated robotic hands
— Passively adaptive and underactuated robotic hands have shown the potential to achieve reliable grasping in unstructured environments without expensive mechanisms or sensors. I...
Matei T. Ciocarlie, Peter K. Allen
RTAS
2010
IEEE
13 years 6 months ago
Physicalnet: A Generic Framework for Managing and Programming Across Pervasive Computing Networks
This paper describes the design and implementation of a pervasive computing framework, named Physicalnet. Essentially, Physicalnet is a generic paradigm for managing and programmi...
Pascal Vicaire, Zhiheng Xie, Enamul Hoque, John A....
UIC
2010
Springer
13 years 6 months ago
A Middleware for Intelligent Environments and the Internet of Things
Interdisciplinary research from the domains of pervasive computing or ubiquitous computing, computer-human-interaction and computer science has led to the development of many intel...
Luis Roalter, Matthias Kranz, Andreas Möller
FIS
2010
13 years 5 months ago
Energy Consumption Information Services for Smart Home Inhabitants
We investigate services giving users an adequate insight on his or her energy consumption habits in order to optimize it in the long run. The explored energy awareness services are...
Michael Schwanzer, Anna Fensel