Sciweavers

11182 search results - page 2105 / 2237
» Shape Analysis of Sets
Sort
View
CODES
2007
IEEE
14 years 4 months ago
Three-dimensional multiprocessor system-on-chip thermal optimization
3D stacked wafer integration has the potential to improve multiprocessor system-on-chip (MPSoC) integration density, performance, and power efficiency. However, the power density...
Chong Sun, Li Shang, Robert P. Dick
CODES
2007
IEEE
14 years 4 months ago
ESL design and HW/SW co-verification of high-end software defined radio platforms
Multiple wireless technologies are converging to run on personal handhelds. The plethora of communication standards next to the cost issues of deeper submicron processing require ...
A. C. H. Ng, J. W. Weijers, Miguel Glassee, Thomas...
GLOBECOM
2007
IEEE
14 years 4 months ago
Minimum Coverage Breach and Maximum Network Lifetime in Wireless Sensor Networks
—Network lifetime is a critical issue in Wireless Sensor Networks. It is possible to extend network lifetime by organizing the sensors into a number of sensor covers. However, wi...
Chen Wang, My T. Thai, Yingshu Li, Feng Wang 0002,...
ICDM
2007
IEEE
166views Data Mining» more  ICDM 2007»
14 years 4 months ago
Mining Statistical Information of Frequent Fault-Tolerant Patterns in Transactional Databases
Constraints applied on classic frequent patterns are too strict and may cause interesting patterns to be missed. Hence, researchers have proposed to mine a more relaxed version of...
Ardian Kristanto Poernomo, Vivekanand Gopalkrishna...
ICDM
2007
IEEE
149views Data Mining» more  ICDM 2007»
14 years 4 months ago
Non-redundant Multi-view Clustering via Orthogonalization
Typical clustering algorithms output a single clustering of the data. However, in real world applications, data can often be interpreted in many different ways; data can have diff...
Ying Cui, Xiaoli Z. Fern, Jennifer G. Dy
« Prev « First page 2105 / 2237 Last » Next »