3D stacked wafer integration has the potential to improve multiprocessor system-on-chip (MPSoC) integration density, performance, and power efficiency. However, the power density...
Multiple wireless technologies are converging to run on personal handhelds. The plethora of communication standards next to the cost issues of deeper submicron processing require ...
A. C. H. Ng, J. W. Weijers, Miguel Glassee, Thomas...
—Network lifetime is a critical issue in Wireless Sensor Networks. It is possible to extend network lifetime by organizing the sensors into a number of sensor covers. However, wi...
Chen Wang, My T. Thai, Yingshu Li, Feng Wang 0002,...
Constraints applied on classic frequent patterns are too strict and may cause interesting patterns to be missed. Hence, researchers have proposed to mine a more relaxed version of...
Typical clustering algorithms output a single clustering of the data. However, in real world applications, data can often be interpreted in many different ways; data can have diff...