1093 search results - page 160 / 219 » Simplifying parallel and distributed simulation with the DUP... |
TPDS
1998
13 years 7 months ago
1998
—Three-dimensional packaging technologies are critical for enabling ultra-compact, massively parallel processors (MPPs) for embedded applications. Through-wafer optical interconn...
ASAP
2005
IEEE
14 years 1 months ago
2005
IEEE
This paper explores low-power reliable microarchitectures for addition. Power, speed, and reliability (both defect- and fault-tolerance) are important metrics of system design, sp...
MSS
1999
IEEE
14 years 2 days ago
1999
IEEE
Benchmark tests have been designed and conducted for the purpose of evaluating the use of automated tape libraries in on-line digital check image retrieval applications. This type...
HPDC
2000
IEEE
14 years 6 days ago
2000
IEEE
While the MPP is still the most common architecture in supercomputer centers today, a simpler and cheaper machine configuration is growing increasingly common. This alternative s...
IPPS
1998
IEEE
14 years 1 days ago
1998
IEEE
Switch-based interconnects are used in a number of application domains including parallel system interconnects, local area networks, and wide area networks. However, very few swit...