Individual dies in 3D integrated circuits are connected using throughsilicon-vias (TSVs). TSVs not only increase manufacturing cost, but also incur silicon area, delay, and power ...
In this paper, we consider the problem of maximizing the battery life (or duration of service) in battery-powered CMOS circuits. We first show that the battery efficiency (or utili...
Gate sizing in VLSI design is a widely-used method for power or area recovery subject to timing constraints. Several previous works have proposed gate sizing heuristics for power ...
Two Simple structures of low-power Dual-edge triggered Static Pulsed Flip-Flops (DSPFF) are presented in this paper. They are composed of a dualedge pulse generator and a static f...
In the nanometer VLSI technology, the variation effects like manufacturing variation, power supply noise, temperature etc. become very significant. As one of the most vital nets...