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SLIP
2009
ACM
14 years 2 months ago
Through-silicon-via aware interconnect prediction and optimization for 3D stacked ICs
Individual dies in 3D integrated circuits are connected using throughsilicon-vias (TSVs). TSVs not only increase manufacturing cost, but also incur silicon area, delay, and power ...
Dae Hyun Kim, Saibal Mukhopadhyay, Sung Kyu Lim
DATE
1999
IEEE
129views Hardware» more  DATE 1999»
14 years 6 days ago
Battery-Powered Digital CMOS Design
In this paper, we consider the problem of maximizing the battery life (or duration of service) in battery-powered CMOS circuits. We first show that the battery efficiency (or utili...
Massoud Pedram, Qing Wu
ISPD
2012
ACM
288views Hardware» more  ISPD 2012»
12 years 3 months ago
Construction of realistic gate sizing benchmarks with known optimal solutions
Gate sizing in VLSI design is a widely-used method for power or area recovery subject to timing constraints. Several previous works have proposed gate sizing heuristics for power ...
Andrew B. Kahng, Seokhyeong Kang
VLSID
2005
IEEE
82views VLSI» more  VLSID 2005»
14 years 8 months ago
Dual-Edge Triggered Static Pulsed Flip-Flops
Two Simple structures of low-power Dual-edge triggered Static Pulsed Flip-Flops (DSPFF) are presented in this paper. They are composed of a dualedge pulse generator and a static f...
Aliakbar Ghadiri, Hamid Mahmoodi-Meimand
ISPD
2005
ACM
130views Hardware» more  ISPD 2005»
14 years 1 months ago
Improved algorithms for link-based non-tree clock networks for skew variability reduction
In the nanometer VLSI technology, the variation effects like manufacturing variation, power supply noise, temperature etc. become very significant. As one of the most vital nets...
Anand Rajaram, David Z. Pan, Jiang Hu