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CODES
2007
IEEE
14 years 2 months ago
2007
IEEE
3D stacked wafer integration has the potential to improve multiprocessor system-on-chip (MPSoC) integration density, performance, and power efficiency. However, the power density...
EMSOFT
2007
Springer
14 years 1 months ago
2007
Springer
Non-volatile RAM (NVRAM) such as PRAM (Phase-change RAM), FeRAM (Ferroelectric RAM), and MRAM (Magnetoresistive RAM) has characteristics of both non-volatile storage and random ac...
EMSOFT
2007
Springer
14 years 1 months ago
2007
Springer
Flash memory has many merits such as light weight, shock resistance, and low power consumption, but also has limitations like the erase-before-write property. To overcome such lim...
HIPEAC
2007
Springer
14 years 1 months ago
2007
Springer
Abstract. Network processors are programmable devices that can process packets at a high speed. A network processor is typified by multithreading and heterogeneous multiprocessing...
LCTRTS
2007
Springer
14 years 1 months ago
2007
Springer
As mobile phones become increasingly multifunctional, the number and size of applications installed in phones are rapidly increasing. Consequently, mobile phones require more hard...