1301 search results - page 127 / 261 » Specifications via Realizability |
CORR
2008
Springer
15 years 3 months ago
2008
Springer
Emerging 3D chips stacking and MEMS/Sensors packaging technologies are using DRIE (Deep Reactive Ion Etching) to etch Through-Silicon Via (TSV) for advanced interconnections. The ...
136
Voted
ENTCS
2006
15 years 3 months ago
2006
We propose a family of models of coordination of distributed object systems representing different views, with refinement relations between the different views. We start with dist...
126
Voted
ICMLA
2010
15 years 1 months ago
2010
Abstract--We study how to effectively integrate reinforcement learning (RL) and programming languages via adaptation-based programming, where programs can include non-deterministic...
140
Voted
ENTCS
2006
15 years 3 months ago
2006
Latency insensitive protocols (LIPs) have been proposed as a viable means to connect synchronous IP blocks via long interconnects in a system-on-chip. The reason why one needs to ...
140
Voted
COCO
2005
Springer
15 years 9 months ago
2005
Springer
We introduce two new complexity measures for Boolean functions, which we name sumPI and maxPI. The quantity sumPI has been emerging through a line of research on quantum query com...