— There is much to gain from providing walking machines with passive dynamics, e.g. by including compliant elements in the structure. These elements can offer interesting propert...
3D die stacking is an exciting new technology that increases transistor density by vertically integrating two or more die with a dense, high-speed interface. The result of 3D die ...
Bryan Black, Murali Annavaram, Ned Brekelbaum, Joh...
As the industry moves toward larger-scale chip multiprocessors, the need to parallelize applications grows. High inter-thread communication delays, exacerbated by over-stressed hi...
Ram Rangan, Neil Vachharajani, Adam Stoler, Guilhe...
This talk will provide an overview of work that I have done with Hana Chockler, Orna Kupferman, and Judea Pearl [1, 2, 10, 9] on defining notions such as causality, explanation, ...
We propose a novel tool, called objSampler, with which users can record and recall “encounters” with objects in ubiquitous computing environments. We encounter various things,...
Jun'ichi Yura, Hideaki Ogawa, Taizo Zushi, Jin Nak...