179 search results - page 21 / 36 » Temperature-aware global placement |
ISPD
2005
ACM
14 years 28 days ago
2005
ACM
Placement is a critical component of today's physical synthesis flow with tremendous impact on the final performance of VLSI designs. However, it accounts for a significant p...
ISVLSI
2007
IEEE
14 years 1 months ago
2007
IEEE
— Y -interconnects for VLSI chips are based on the use of global and semi-global wiring in only 0◦ , 60◦ , and 120◦ . Though X-interconnects are fast replacing the traditio...
ISPD
2004
ACM
14 years 24 days ago
2004
ACM
VLSI placement tools usually work in two steps: First, the cells that have to be placed are roughly spread out over the chip area ignoring disjointness (global placement). Then, i...
ICCAD
2006
IEEE
14 years 4 months ago
2006
IEEE
We present a novel incremental placement methodology called FlowPlace for significantly reducing critical path delays of placed standard-cell circuits. FlowPlace includes: a) a t...
NSDI
2010
13 years 8 months ago
2010
: As cloud services grow to span more and more globally distributed datacenters, there is an increasingly urgent need for automated mechanisms to place application data across thes...