179 search results - page 8 / 36 » Temperature-aware global placement |
ASPDAC
2005
ACM
14 years 28 days ago
2005
ACM
— The recent popularity of 3D IC technology stems from its enhanced performance capabilities and reduced wirelength. However, wire congestion and thermal issues are exacerbated d...
DAC
2005
ACM
14 years 8 months ago
2005
ACM
We demonstrate how to use placement to ameliorate the predicted repeater explosion problem caused by poor interconnect scaling. We achieve repeater count reduction by dynamically ...
ISPD
2006
ACM
14 years 1 months ago
2006
ACM
In this invited note we outline several algorithms and features appearing in Capo 10, free open-source software for congestion-driven standard cell placement, mixed-size placement...
ISPD
2006
ACM
14 years 1 months ago
2006
ACM
APlace is a high quality, scalable analytical placer. This paper describes our recent efforts to improve APlace for speed and scalability. We explore various wirelength and densi...
ICCAD
2006
IEEE
14 years 1 months ago
2006
IEEE
In addition to wirelength, modern placers need to consider various constraints such as preplaced blocks and density. We propose a high-quality analytical placement algorithm consi...