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» Tera-scale computing and interconnect challenges
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DAC
2009
ACM
14 years 7 months ago
Exploring serial vertical interconnects for 3D ICs
Three-dimensional integrated circuits (3D ICs) offer a promising solution to overcome the on-chip communication bottleneck and improve performance over traditional two-dimensional...
Sudeep Pasricha
EUROPAR
2009
Springer
14 years 1 months ago
A Case Study of Communication Optimizations on 3D Mesh Interconnects
Optimal network performance is critical to efficient parallel scaling for communication-bound applications on large machines. With wormhole routing, no-load latencies do not increa...
Abhinav Bhatele, Eric J. Bohm, Laxmikant V. Kal&ea...
DATE
2010
IEEE
140views Hardware» more  DATE 2010»
13 years 11 months ago
Variation-aware interconnect extraction using statistical moment preserving model order reduction
—1 In this paper we present a stochastic model order reduction technique for interconnect extraction in the presence of process variabilities, i.e. variation-aware extraction. It...
Tarek A. El-Moselhy, Luca Daniel
CADUI
2004
13 years 8 months ago
A Lightweight Experiment Management System for Handheld Computers
: This paper describes a system that helps HCI practitioners and researchers manage and conduct experiments involving context-sensitive handheld applications, particularly related ...
Philip D. Gray, Joy Goodman, James Macleod
HPCA
2009
IEEE
14 years 7 months ago
In-Network Snoop Ordering (INSO): Snoopy coherence on unordered interconnects
Realizing scalable cache coherence in the many-core era comes with a whole new set of constraints and opportunities. It is widely believed that multi-hop, unordered on-chip networ...
Niket Agarwal, Li-Shiuan Peh, Niraj K. Jha