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ICCAD
2009
IEEE
154views Hardware» more  ICCAD 2009»
13 years 5 months ago
Pad assignment for die-stacking System-in-Package design
Wire bonding is the most popular method to connect signals between dies in System-in-Package (SiP) design nowadays. Pad assignment, which assigns inter-die signals to die pads so ...
Yu-Chen Lin, Wai-Kei Mak, Chris Chu, Ting-Chi Wang
CCE
2010
13 years 5 months ago
Combined mass and energy integration in process design at the example of membrane-based gas separation systems
This paper presents an approach for combined mass and energy integration in process synthesis and illustrates it at the thermochemical production of crude synthetic natural gas (S...
Martin Gassner, François Maréchal
COLING
2010
13 years 2 months ago
EMMA: A novel Evaluation Metric for Morphological Analysis
We present a novel Evaluation Metric for Morphological Analysis (EMMA) that is both linguistically appealing and empirically sound. EMMA uses a graphbased assignment algorithm, op...
Sebastian Spiegler, Christian Monson
CORR
2010
Springer
315views Education» more  CORR 2010»
13 years 2 months ago
Light-Hierarchy: The Optimal Structure for Multicast Routing in WDM Mesh Networks
Abstract--Based on the false assumption that multicast incapable (MI) nodes could not be traversed twice on the same wavelength, the light-tree structure was always thought to be o...
Fen Zhou, Miklós Molnár, Bernard Cou...
SPEECH
2010
154views more  SPEECH 2010»
13 years 2 months ago
Long story short - Global unsupervised models for keyphrase based meeting summarization
act 11 We analyze and compare two different methods for unsupervised extractive spontaneous speech summarization in the meeting 12 domain. Based on utterance comparison, we introdu...
Korbinian Riedhammer, Benoît Favre, Dilek Ha...