14386 search results - page 2849 / 2878 » The Chinese Generals Problem |
ICCAD
2009
IEEE
13 years 5 months ago
2009
IEEE
Heat removal and power delivery have become two major reliability concerns in 3D stacked IC technology. For thermal problem, two possible solutions exist: thermal-through-silicon-...
ICCAD
2009
IEEE
13 years 5 months ago
2009
IEEE
Multi-core processors have become an integral part of mainstream high performance computer systems. In parallel, exponentially increasing power density and packaging costs have ne...
ICDCS
2009
IEEE
13 years 5 months ago
2009
IEEE
In recent years, there are substantial demands to reduce packet loss in the Internet. Among the schemes proposed, finding backup paths in advance is considered to be an effective ...
ICDM
2009
IEEE
13 years 5 months ago
2009
IEEE
There has been significant recent interest in sparse metric learning (SML) in which we simultaneously learn both a good distance metric and a low-dimensional representation. Unfor...
ICTAC
2009
Springer
13 years 5 months ago
2009
Springer
Testing from first-order specifications has mainly been studied for flat specifications, that are specifications of a single software module. However, the specifications of large s...