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» The Impact of Technology Scaling on Lifetime Reliability
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DAC
2006
ACM
14 years 11 months ago
A thermally-aware performance analysis of vertically integrated (3-D) processor-memory hierarchy
Three-dimensional (3-D) integrated circuits have emerged as promising candidates to overcome the interconnect bottlenecks of nanometer scale designs. While they offer several othe...
Gian Luca Loi, Banit Agrawal, Navin Srivastava, Sh...
ISLPED
2009
ACM
168views Hardware» more  ISLPED 2009»
14 years 5 months ago
Low power circuit design based on heterojunction tunneling transistors (HETTs)
The theoretical lower limit of subthreshold swing in MOSFETs (60 mV/decade) significantly restricts low voltage operation since it results in a low ON to OFF current ratio at low ...
Daeyeon Kim, Yoonmyung Lee, Jin Cai, Isaac Lauer, ...
INTEGRATION
2008
96views more  INTEGRATION 2008»
13 years 11 months ago
Implementation of a thermal management unit for canceling temperature-dependent clock skew variations
Thermal gradients across the die are becoming increasingly prominent as we scale further down into the sub-nanometer regime. While temperature was never a primary concern, its non...
Ashutosh Chakraborty, Karthik Duraisami, Ashoka Vi...
IMC
2004
ACM
14 years 4 months ago
Measurement based characterization and provisioning of IP VPNs
Virtual Private Networks provide secure and reliable communication between customer sites. With increase in number and size of VPNs, providers need efficient provisioning techniqu...
Satish Raghunath, K. K. Ramakrishnan, Shivkumar Ka...