In this paper we present a continuous surface model to describe the interconnect geometric variation, which improves the currently used model for better accuracy while not increas...
The amount of physical variation among electronic components on a die is increasing rapidly. There is a need for a better understanding of variations in transient fault susceptibil...
Manufacturable design requires matching of interconnects which have equal nominal dimensions. New design rules are projected to bring guarantee rules for interconnect matching. In...
Many architecture–based software reliability models were proposed in the past. Regardless of the accuracy of these models, if a considerable uncertainty exists in the estimates ...
In this paper, we construct nonbinary quasi-cyclic low-density parity-check (QC-LDPC) codes whose parity check matrices consist of an array of square sub-matrices which are either ...