The advent of portable and high-density devices has made power consumption a critical design concern. In this paper, we address the problem of reducing power consumption via gate-...
In this paper, we present a new multi-packing tree (MP-tree) representation for macro placement to handle mixed-size designs. Based on binary trees, the MP-tree is very efficient,...
Abstract--Technology scaling in the nanometer era has increased the transistor's susceptibility to process variations. The effects of such variations are having a huge impact ...
Venkataraman Mahalingam, N. Ranganathan, J. E. Har...
Decreasing feature sizes and increasing package densities are making thermal issues extremely important in IC design. Uneven thermal maps and hot spots in ICs cause physical stres...
With aggressive reductions in feature sizes and the integration of multiple functionalities on the same die, bottlenecks due to I/O pin limitations have become a severe issue in to...