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» The Sizing Rules Method for Analog Integrated Circuit Design
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SLIP
2009
ACM
14 years 2 months ago
Through-silicon-via aware interconnect prediction and optimization for 3D stacked ICs
Individual dies in 3D integrated circuits are connected using throughsilicon-vias (TSVs). TSVs not only increase manufacturing cost, but also incur silicon area, delay, and power ...
Dae Hyun Kim, Saibal Mukhopadhyay, Sung Kyu Lim
ICCD
2004
IEEE
119views Hardware» more  ICCD 2004»
14 years 4 months ago
I/O Clustering in Design Cost and Performance Optimization for Flip-Chip Design
I/O placement has always been a concern in modern IC design. Due to flip-chip technology, I/O can be placed throughout the whole chip without long wires from the periphery of the...
Hung-Ming Chen, I-Min Liu, Martin D. F. Wong, Muzh...
DAC
2009
ACM
13 years 11 months ago
Fast vectorless power grid verification using an approximate inverse technique
Power grid verification in modern integrated circuits is an integral part of early system design where adjustments can be most easily incorporated. In this work, we describe an ea...
Nahi H. Abdul Ghani, Farid N. Najm
DAC
2004
ACM
14 years 8 months ago
Large-scale full-wave simulation
We describe a new extraction tool, EMX (Electro-Magnetic eXtractor), for the analysis of RF, analog and high-speed digital circuits. EMX is a fast full-wave field solver. It incor...
Sharad Kapur, David E. Long
BXML
2003
13 years 9 months ago
Rule-Based Generation of XML Schemas from UML Class Diagrams
We present an approach of how to automatically extract an XML document structure from a conceptual data model that describes the content of the document. We use UML class diagrams ...
Tobias Krumbein, Thomas Kudrass