Individual dies in 3D integrated circuits are connected using throughsilicon-vias (TSVs). TSVs not only increase manufacturing cost, but also incur silicon area, delay, and power ...
I/O placement has always been a concern in modern IC design. Due to flip-chip technology, I/O can be placed throughout the whole chip without long wires from the periphery of the...
Hung-Ming Chen, I-Min Liu, Martin D. F. Wong, Muzh...
Power grid verification in modern integrated circuits is an integral part of early system design where adjustments can be most easily incorporated. In this work, we describe an ea...
We describe a new extraction tool, EMX (Electro-Magnetic eXtractor), for the analysis of RF, analog and high-speed digital circuits. EMX is a fast full-wave field solver. It incor...
We present an approach of how to automatically extract an XML document structure from a conceptual data model that describes the content of the document. We use UML class diagrams ...