570 search results - page 31 / 114 » The behavior of resistive circuits |
ASPDAC
2006
ACM
14 years 1 months ago
2006
ACM
Three-dimensional integrated circuits (3D ICs) provide an attractive solution for improving circuit performance. Such solutions must be embedded in an electrothermally-conscious d...
ISCAS
2005
IEEE
14 years 1 months ago
2005
IEEE
Abstract— The analysis of effects induced by interconnects become increasingly important as the scale of process technologies steadily shrinks. While most analyses focus on the t...
DAC
1997
ACM
13 years 11 months ago
1997
ACM
This paper describes a new design methodology to analyze the on-chip power supply noise for high performance microprocessors. Based on an integrated package-level and chip-level p...
ITC
1997
IEEE
13 years 11 months ago
1997
IEEE
This paper proposes an environment to address Testability Analysis and Test Pattern Generation on VHDL descriptions at the RT-level. The proposed approach, based on a suitable fau...
CSREAESA
2003
13 years 9 months ago
2003
The paper presents a technique for the design of digital circuits based on reusable hardware templates (HT). Any HT is being constructed in such a way that it might be employed for...