Abstract. Modern microprocessors have sacrificed the exactness of exceptions for improved performance long ago. This is a side effect of reordering instructions so that the micropr...
3D die stacking is an exciting new technology that increases transistor density by vertically integrating two or more die with a dense, high-speed interface. The result of 3D die ...
Bryan Black, Murali Annavaram, Ned Brekelbaum, Joh...
Asynchronous design has a potential of solving many difficulties, such as clock skew and power consumption, which synchronous counterpart suffers with current and future VLSI tech...
This work considers switching fabrics with distributed packet routing to achieve high scalability and low costs. The considered switching fabrics are based on a multistage structu...
The memory hierarchy of a system can consume up to 50% of microprocessor system power. Previous work has shown that tuning a configurable cache to a particular application can red...