1994 search results - page 43 / 399 » The design of a high performance low power microprocessor |
EUROPAR
2004
Springer
14 years 15 days ago
2004
Springer
Abstract. Modern microprocessors have sacrificed the exactness of exceptions for improved performance long ago. This is a side effect of reordering instructions so that the micropr...
MICRO
2006
IEEE
14 years 2 months ago
2006
IEEE
3D die stacking is an exciting new technology that increases transistor density by vertically integrating two or more die with a dense, high-speed interface. The result of 3D die ...
ICCD
1997
IEEE
14 years 10 days ago
1997
IEEE
Asynchronous design has a potential of solving many difficulties, such as clock skew and power consumption, which synchronous counterpart suffers with current and future VLSI tech...
ICPP
2002
IEEE
14 years 1 months ago
2002
IEEE
This work considers switching fabrics with distributed packet routing to achieve high scalability and low costs. The considered switching fabrics are based on a multistage structu...
DAC
2007
ACM
14 years 9 months ago
2007
ACM
The memory hierarchy of a system can consume up to 50% of microprocessor system power. Previous work has shown that tuning a configurable cache to a particular application can red...