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SLIP
2009
ACM
14 years 3 months ago
Through-silicon-via aware interconnect prediction and optimization for 3D stacked ICs
Individual dies in 3D integrated circuits are connected using throughsilicon-vias (TSVs). TSVs not only increase manufacturing cost, but also incur silicon area, delay, and power ...
Dae Hyun Kim, Saibal Mukhopadhyay, Sung Kyu Lim
CDC
2008
IEEE
116views Control Systems» more  CDC 2008»
14 years 3 months ago
Effective sensing regions and connectivity of agents undergoing periodic relative motions
— Time-varying graphs are widely used to model communication and sensing in multi-agent systems such as mobile sensor networks and dynamic animal groups. Connectivity is often de...
Daniel T. Swain, Ming Cao, Naomi Ehrich Leonard
ICASSP
2008
IEEE
14 years 3 months ago
Subspace compressive detection for sparse signals
The emerging theory of compressed sensing (CS) provides a universal signal detection approach for sparse signals at sub-Nyquist sampling rates. A small number of random projection...
Zhongmin Wang, Gonzalo R. Arce, Brian M. Sadler
ICDCSW
2008
IEEE
14 years 3 months ago
Understanding the Tolerance of Dynamic Networks: A Routing-Oriented Approach
Research on delay tolerant networks (DTNs) has brought about a plethora of routing algorithms targeted at networks with different mobility patterns. However, few research works ha...
Yifeng Shao, Jie Wu
ICPR
2008
IEEE
14 years 3 months ago
Layered shape matching and registration: Stochastic sampling with hierarchical graph representation
To automatically register foreground target in cluttered images, we present a novel hierarchical graph representation and a stochastic computing strategy in Bayesian framework. Th...
Xiaobai Liu, Liang Lin, Hongwei Li, Hai Jin, Wenbi...