50 search results - page 5 / 10 » Thermal modeling and analysis of 3D multi-processor chips |
BIRTHDAY
2012
Springer
12 years 3 months ago
2012
Springer
3-D integration presents many new opportunities for architects and embedded systems designers. However, 3-D integration has not yet been explored by the cryptographic hardware com...
ISQED
2003
IEEE
14 years 21 days ago
2003
IEEE
This paper presents an electrical and thermal performance analysis of System-in-a-Package (SiP) memory/logic implementation platform based on ChipLaminate-Chip (CLC) technology. I...
GLVLSI
2007
IEEE
14 years 1 months ago
2007
IEEE
Multi-Processor System-On-Chip (MPSoC) can provide the performance levels required by high-end embedded applications. However, they do so at the price of an increasing power densi...
HPCN
1994
Springer
13 years 11 months ago
1994
Springer
The exact knowledge of the heat flow in heterojunction bipolar transistors (HBT) during power operation is an important key factor for the systematic improvement of power density,...
ICS
2009
Tsinghua U.
14 years 10 hour ago
2009
Tsinghua U.
Large Multi-Processor Systems-on-Chip use Networks-on-Chip with a high degree of reusability and scalability for message communication. Therefore, network infrastructure is a cruc...