The existing work on via-stapling in 3D integrated circuits optimizes power and thermal integrity separately and uses steadystate thermal analysis. This paper presents the first ...
— The recent popularity of 3D IC technology stems from its enhanced performance capabilities and reduced wirelength. However, wire congestion and thermal issues are exacerbated d...
Three-dimensional integrated circuits (3D ICs) provide an attractive solution for improving circuit performance. Such solutions must be embedded in an electrothermally-conscious d...
: Thermal issue is a critical challenge in 3D IC circuit design. Incorporating thermal vias into 3D IC is a promising way to mitigate thermal issues by lowering down the thermal re...
All existing methods for thermal-via allocation are based on a steady-state thermal analysis and may lead to excessive number of thermal vias. This paper develops an accurate and ...