Thermal via allocation for 3D ICs considering temporally and spatially variant thermal power

All existing methods for thermal-via allocation are based on a steady-state thermal analysis and may lead to excessive number of thermal vias. This paper develops an accurate and efficient thermal-via allocation considering temporally and spatially variant thermal-power. The transient temperature is calculated using macromodel by a structured and parameterized model reduction, which generates temperature sensitivity with respect to thermalvia density. By defining a thermal-violation integral based on the transient temperature, a nonlinear optimization problem is formulated to allocate thermal-vias and minimize thermal violation integral. This optimization problem is transformed into a sequence of subproblems by Lagrangian relaxation, and each subproblem is solved by quadratic programming using sensitives from the macromodel. Experiments show that compared to the existing method using steady-state thermal analysis, our method is 126X faster to obtain the temperature profile, and redu...

• Type: Conference
• Year: 2006
• Where: ISLPED
• Authors: Hao Yu, Yiyu Shi, Lei He, Tanay Karnik
• Keywords: ISLPED 2006, Steady-state Thermal Analysis, Thermal Vias, Transient Temperature