17 search results - page 3 / 4 » Three Dimensional VLSI-Scale Interconnects |
VR
2002
IEEE
14 years 13 days ago
2002
IEEE
Virtual Reality allows a simultaneous representation of three dimensional objects in different interconnected visualization installations [3]. This offers new possibilities for di...
CGF
2011
12 years 11 months ago
2011
The complexity and detail of geometric scenes that are used in today’s computer animated films and interactive games have reached a level where the manual creation by tradition...
ICCD
2004
IEEE
14 years 4 months ago
2004
IEEE
Three dimensional vertically integrated systems allow active devices to be placed on multiple device layers. In recent years, a number of research efforts have addressed physical ...
ISCA
2008
IEEE
14 years 1 months ago
2008
IEEE
Recently, Network-on-Chip (NoC) architectures have gained popularity to address the interconnect delay problem for designing CMP / multi-core / SoC systems in deep sub-micron tech...
PARELEC
2002
IEEE
14 years 13 days ago
2002
IEEE
One of the crucial aspects in the design process of high voltage apparatus is the precise simulation of the electrostatic and/or electromagnetic £eld distribution in three dimens...