We introduce a novel chip fabrication technique called “brick and mortar”, in which chips are made from small, pre-fabricated ASIC bricks and bonded in a designer-specified a...
Martha Mercaldi Kim, Mojtaba Mehrara, Mark Oskin, ...
— Existing sensor network architectures are based on the assumption that data will be polled. Therefore, they are not adequate for long-term battery-powered use in applications t...
Sasha Jevtic, Mathew Kotowsky, Robert P. Dick, Pet...
System-on-chip communication architectures have a significant impact on the performance and power consumption of modern multiprocessor system-on-chips (MPSoCs). However, customiza...
Sudeep Pasricha, Young-Hwan Park, Fadi J. Kurdahi,...
We discuss an imaging architecture for sensor pixel in the ALOHA signals an event when a certain amount network applications, that employs a 32 x 32 Address-Event of photons are re...
Thiago Teixeira, Eugenio Culurciello, Andreas G. A...
The multilevel placement package mPL6 combines improved implementations of the global placer mPL5 (ISPD05) and the XDP legalizer and detailed placer (ASPDAC06). It consistently pr...
Tony F. Chan, Jason Cong, Joseph R. Shinnerl, Kent...