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Transparent Reconfigurable Acceleration for Heterogeneous Em...
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2006
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Adaptive chip-package thermal analysis for synthesis and design
15 years 9 months ago
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Ever-increasing integrated circuit (IC) power densities and peak temperatures threaten reliability, performance, and economical cooling. To address these challenges, thermal analy...
Yonghong Yang, Zhenyu (Peter) Gu, Changyun Zhu, Li...
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