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» Trends in Embedded-Microprocessor Design
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DATE
2009
IEEE
155views Hardware» more  DATE 2009»
14 years 4 months ago
Dynamic thermal management in 3D multicore architectures
— Technology scaling has caused the feature sizes to shrink continuously, whereas interconnects, unlike transistors, have not followed the same trend. Designing 3D stack architec...
Ayse Kivilcim Coskun, José L. Ayala, David ...
DATE
2009
IEEE
122views Hardware» more  DATE 2009»
14 years 4 months ago
A highly resilient routing algorithm for fault-tolerant NoCs
Current trends in technology scaling foreshadow worsening transistor reliability as well as greater numbers of transistors in each system. The combination of these factors will so...
David Fick, Andrew DeOrio, Gregory K. Chen, Valeri...
DATE
2009
IEEE
110views Hardware» more  DATE 2009»
14 years 4 months ago
Light NUCA: A proposal for bridging the inter-cache latency gap
Abstract—To deal with the “memory wall” problem, microprocessors include large secondary on-chip caches. But as these caches enlarge, they originate a new latency gap between...
Darío Suárez Gracia, Teresa Monreal,...
ICRA
2009
IEEE
92views Robotics» more  ICRA 2009»
14 years 4 months ago
Observations and models for needle-tissue interactions
— The asymmetry of a bevel-tip needle results in the needle naturally bending when it is inserted into soft tissue. In this study we present a mechanics-based model that calculat...
Sarthak Misra, Kyle B. Reed, Benjamin W. Schafer, ...
IPPS
2009
IEEE
14 years 4 months ago
A component-based framework for the Cell Broadband Engine
With the increasing trend of microprocessor manufacturers to rely on parallelism to increase their products’ performance, there is an associated increasing need for simple techn...
Timothy D. R. Hartley, Ümit V. Çataly&...