159 search results - page 24 / 32 » User- and process-driven dynamic voltage and frequency scali... |
ICCAD
2006
IEEE
14 years 4 months ago
2006
IEEE
With the continued scaling of CMOS technologies and reduced design margins, the reliability concerns induced by transient faults have become prominent. Moreover, the popular energ...
ISCAS
2005
IEEE
14 years 1 months ago
2005
IEEE
— In this paper we explore the relationship between power and area. By exploiting parallelism (and thus using more area) one can reduce the switching frequency allowing a reducti...
DATE
2010
IEEE
14 years 19 days ago
2010
IEEE
Abstract—Future microprocessors increasingly rely on an unreliable CMOS fabric due to aggressive scaling of voltage and frequency, and shrinking design margins. Fortunately, many...
DAC
2009
ACM
14 years 8 months ago
2009
ACM
Exponentially rising cooling/packaging costs due to high power density call for architectural and software-level thermal management. Dynamic thermal management (DTM) techniques co...
ISPASS
2008
IEEE
14 years 1 months ago
2008
IEEE
The evolution of microprocessors has been hindered by their increasing power consumption and the heat generation speed on-die. High temperature impairs the processor’s reliabili...