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3DIC
2009
IEEE
279views Hardware» more  3DIC 2009»
14 years 3 months ago
Compact modelling of Through-Silicon Vias (TSVs) in three-dimensional (3-D) integrated circuits
Abstract—Modeling parasitic parameters of Through-SiliconVia (TSV) structures is essential in exploring electrical characteristics such as delay and signal integrity (SI) of circ...
Roshan Weerasekera, Matt Grange, Dinesh Pamunuwa, ...
UIST
2004
ACM
14 years 2 months ago
Multi-finger gestural interaction with 3d volumetric displays
Volumetric displays provide interesting opportunities and challenges for 3D interaction and visualization, particularly when used in a highly interactive manner. We explore this a...
Tovi Grossman, Daniel Wigdor, Ravin Balakrishnan
CONSTRAINTS
2008
107views more  CONSTRAINTS 2008»
13 years 8 months ago
A Constraint-Based Autonomous 3D Camera System
Camera control techniques for Interactive Digital Entertainment (IDE) are reaching their limits in terms of capabilities. To enable future growth, new methods must be derived to a...
Owen Bourne, Abdul Sattar, Scott D. Goodwin
ISPD
2011
ACM
253views Hardware» more  ISPD 2011»
12 years 11 months ago
Assembling 2D blocks into 3D chips
Three-dimensional ICs promise to significantly extend the scale of system integration and facilitate new-generation electronics. However, progress in commercial 3D ICs has been s...
Johann Knechtel, Igor L. Markov, Jens Lienig
SEKE
2007
Springer
14 years 2 months ago
EvoSpaces: 3D Visualization of Software Architecture
This paper presents the Evospaces reverse-engineering tool that represents the architecture and metrics of complex software systems in a 3D virtual world. The main goal of our pro...
Sazzadul Alam, Philippe Dugerdil