Abstract—Modeling parasitic parameters of Through-SiliconVia (TSV) structures is essential in exploring electrical characteristics such as delay and signal integrity (SI) of circ...
Roshan Weerasekera, Matt Grange, Dinesh Pamunuwa, ...
Volumetric displays provide interesting opportunities and challenges for 3D interaction and visualization, particularly when used in a highly interactive manner. We explore this a...
Camera control techniques for Interactive Digital Entertainment (IDE) are reaching their limits in terms of capabilities. To enable future growth, new methods must be derived to a...
Three-dimensional ICs promise to significantly extend the scale of system integration and facilitate new-generation electronics. However, progress in commercial 3D ICs has been s...
This paper presents the Evospaces reverse-engineering tool that represents the architecture and metrics of complex software systems in a 3D virtual world. The main goal of our pro...