1682 search results - page 23 / 337 » Variational Constraints in 3D |
VLSID
2010
IEEE
13 years 7 months ago
2010
IEEE
Due to the inherent nature of heat flow in 3D integrated circuits, stacked dies exhibit a wide range of thermal characteristics. The strong dependence of leakage with temperature...
ACIVS
2008
Springer
13 years 10 months ago
2008
Springer
Sensitivity of global features to pose, illumination and scale variations encouraged researchers to use local features for object representation and recognition. Availability of 3D...
ASPDAC
2012
ACM
12 years 4 months ago
2012
ACM
—The 3D IC integration using through-silicon-vias (TSV) has gained tremendous momentum recently for industry adoption. However, as TSV involves disruptive manufacturing technolog...
CVPR
1998
IEEE
14 years 10 months ago
1998
IEEE
Image texture can arise not only from surface albedo variations (2D texture) but also from surface height variations (3D texture). Since the appearance of 3D texture depends on th...
ICCV
1999
IEEE
14 years 10 months ago
1999
IEEE
While an exact definition of texture is somewhat elusive, texture can be qualitatively described as a distribution of color, albedo or local normal on a surface. In the literature...