Interconnect is one of the major concerns in current and future microprocessor designs from both performance and power consumption perspective. The emergence of three-dimensional ...
Balaji Vaidyanathan, Wei-Lun Hung, Feng Wang 0004,...
Abstract. We present some recent progress in designing and implementing two interactive image-based 3D modeling systems. The first system constructs 3D models from a collection of ...
Heung-Yeung Shum, Richard Szeliski, Simon Baker, M...
Active Appearance Models (AAMs) are generative models commonly used to model faces. Another closely related type of face models are 3D Morphable Models (3DMMs). Although AAMs are ...
Jing Xiao, Simon Baker, Iain Matthews, Takeo Kanad...
3D die stacking is an exciting new technology that increases transistor density by vertically integrating two or more die with a dense, high-speed interface. The result of 3D die ...
Bryan Black, Murali Annavaram, Ned Brekelbaum, Joh...
The technological advance of sensors is producing an exponential size growth of the data coming from 3D scanning and digital photography. The production of digital 3D models consi...
Marco Callieri, Paolo Cignoni, Massimiliano Corsin...