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VLSID
2007
IEEE
14 years 9 months ago
2007
IEEE
Interconnect is one of the major concerns in current and future microprocessor designs from both performance and power consumption perspective. The emergence of three-dimensional ...
SMILE
1998
Springer
14 years 1 months ago
1998
Springer
Abstract. We present some recent progress in designing and implementing two interactive image-based 3D modeling systems. The first system constructs 3D models from a collection of ...
CVPR
2004
IEEE
14 years 11 months ago
2004
IEEE
Active Appearance Models (AAMs) are generative models commonly used to model faces. Another closely related type of face models are 3D Morphable Models (3DMMs). Although AAMs are ...
MICRO
2006
IEEE
14 years 2 months ago
2006
IEEE
3D die stacking is an exciting new technology that increases transistor density by vertically integrating two or more die with a dense, high-speed interface. The result of 3D die ...
CG
2008
Springer
13 years 9 months ago
2008
Springer
The technological advance of sensors is producing an exponential size growth of the data coming from 3D scanning and digital photography. The production of digital 3D models consi...