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» Verifying and Validating Simulation Models
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2009
IEEE
113views Hardware» more  DATE 2009»
15 years 10 months ago
New simulation methodology of 3D surface roughness loss for interconnects modeling
— As clock frequencies exceed giga-Hertz, the extra power loss due to conductor surface roughness in interconnects and packagings is more evident and thus demands a proper accou...
Quan Chen, Ngai Wong