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ISCAS
1995
IEEE
66views Hardware» more  ISCAS 1995»
13 years 11 months ago
Vertical Signal Transmission in Three-Dimensional Integrated Circuits by Capacitive Coupling
Stefan A. Kühn, Michael B. Kleiner, Roland Th...
ISCAS
2007
IEEE
179views Hardware» more  ISCAS 2007»
14 years 2 months ago
Analysis for Signal and Power Integrity Using the Multilayered Finite Difference Method
— We present a method for fast analysis of signal and power integrity based on a recently developed multilayered finite difference method (M-FDM). In order to accurately model m...
Ege Engin, Krishna Bharath, Madhavan Swaminathan