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ICCAD
2010
IEEE
13 years 8 months ago
2010
IEEE
In 3D integrated circuits through silicon vias (TSVs) are used to connect different dies stacked on top of each other. These TSV occupy silicon area and have significantly larger a...
COLING
2010
13 years 4 months ago
2010
This paper presents the novel task of best topic word selection, that is the selection of the topic word that is the best label for a given topic, as a means of enhancing the inte...
FOCS
2000
IEEE
14 years 2 months ago
2000
IEEE
We prove that Best Fit bin packing has linear waste on the discrete distribution Ufj kg (where items are drawn uniformly from the set f1=k 2=3 j=kg) for sufficiently large k when...
DAM
2006
13 years 10 months ago
2006
When applying the 2-opt heuristic to the travelling salesman problem, selecting the best improvement at each iteration gives worse results on average than selecting the first impr...
SEMWEB
2009
Springer
14 years 4 months ago
2009
Springer
Abstract. This paper describes an approach to SKOS vocabulary mapping that takes into account the context in which vocabulary terms are used in annotations. The standard vocabulary...