188 search results - page 38 / 38 » Workloads of the Future |
CODES
2008
IEEE
13 years 9 months ago
2008
IEEE
In view of a booming market for microelectronic implants, our ongoing research work is focusing on the specification and design of a novel biomedical microprocessor core targeting...
TCAD
2008
13 years 7 months ago
2008
Three-dimensional integration has the potential to improve the communication latency and integration density of chip-level multiprocessors (CMPs). However, the stacked highpower de...
ISCA
2011
IEEE
12 years 11 months ago
2011
IEEE
Emerging memory technologies such as STT-RAM, PCRAM, and resistive RAM are being explored as potential replacements to existing on-chip caches or main memories for future multi-co...