High Performance Computing data centers have been rapidly growing, both in number and size. Thermal management of data centers can address dominant problems associated with cooling...
Qinghui Tang, Sandeep K. S. Gupta, Georgios Varsam...
Concurrent engineering (CE) design demands the consideration of product life-cycle issues in the early product design stage. Among various life-cycle issues, this work concentrate...
Abstract--This paper explores packet loss recovery for automatic speech recognition (ASR) in spoken dialog systems, assuming an architecture in which a lightweight client communica...
Constantinos Boulis, Mari Ostendorf, Eve A. Riskin...
Conductive micro-patterned copper tracks were fabricated by UV direct-writing of a nanoparticle silver seed layer followed by selective electroless copper deposition. Silver ions w...
Jack Hoyd-Gigg Ng, Marc P. Y. Desmulliez, Aongus M...
Air cooling limits have been a major design challenge in recent years for integrated circuits. Multi-core exacerbates thermal challenges because power scales with the number of co...
Wei Huang, Mircea R. Stan, Karthik Sankaranarayana...