— The rapid increase in IC design complexity and wide-spread use of intellectual-property (IP) blocks have made the so-called mixed-size placement a very important topic in recen...
Abstract— In the UDSM era, crosstalk is an area of considerable concern for designers, as it can have a considerable impact on the yield, both in terms of functionality and opera...
Thermal effects are becoming increasingly important during integrated circuit design. Thermal characteristics influence reliability, power consumption, cooling costs, and performan...
— Due to its great flexibility, gridless routing is desirable for nanometer circuit designs that use variable wire widths and spacings. Nevertheless, it is much more difficult ...
The multilevel placement package mPL6 combines improved implementations of the global placer mPL5 (ISPD05) and the XDP legalizer and detailed placer (ASPDAC06). It consistently pr...
Tony F. Chan, Jason Cong, Joseph R. Shinnerl, Kent...