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aspdac 2007
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Fast Flip-Chip Pin-Out Designation Respin by Pin-Block Design and Floorplanning for Package-Board Codesign
14 years 16 days ago
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www.cecs.uci.edu
Deep submicron effects drive the complication in designing chips, as well as in package designs and communications between package and board. As a result, the iterative interface d...
Ren-Jie Lee, Ming-Fang Lai, Hung-Ming Chen
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