1416 search results - page 215 / 284 » cost 2009 |
ICCAD
2009
IEEE
13 years 6 months ago
2009
IEEE
Wire bonding is the most popular method to connect signals between dies in System-in-Package (SiP) design nowadays. Pad assignment, which assigns inter-die signals to die pads so ...
ICCAD
2009
IEEE
13 years 6 months ago
2009
IEEE
In this paper, we propose a new technique, referred to as virtual probe (VP), to efficiently measure, characterize and monitor both inter-die and spatially-correlated intra-die va...
ICCV
2009
IEEE
13 years 6 months ago
2009
IEEE
Visual tracking is a challenging problem, as an object may change its appearance due to pose variations, illumination changes, and occlusions. Many algorithms have been proposed t...
ICCV
2009
IEEE
13 years 6 months ago
2009
IEEE
In this paper we introduce a novel approach to single view reconstruction using shape grammars. Our approach consists in modeling architectural styles using a set of basic shapes ...
ICDAR
2009
IEEE
13 years 6 months ago
2009
IEEE
A novel method for the segmentation of double-sided ancient document images suffering from bleed-through effect is presented. It takes advantage of the level set framework to prov...