120 search results - page 13 / 24 » dac 2007 |
DAC
2007
ACM
14 years 12 months ago
2007
ACM
Thermal problems and limitations on interlayer via densities are important design constraints on three-dimensional integrated circuits (3D ICs), and need to be considered during g...
DAC
2007
ACM
14 years 12 months ago
2007
ACM
Three-Dimensional integration provides a simultaneous improvement in wire-related delay and power consumption of microprocessor circuits. Prior work has looked at the performance,...
DAC
2007
ACM
14 years 12 months ago
2007
ACM
The memory hierarchy of a system can consume up to 50% of microprocessor system power. Previous work has shown that tuning a configurable cache to a particular application can red...
DAC
2007
ACM
14 years 12 months ago
2007
ACM
Many STUMPS architectures found in current chip designs allow disabling of individual scan chains for debug and diagnosis. In a recent paper it has been shown that this feature can...
DAC
2007
ACM
14 years 12 months ago
2007
ACM
A key step in the design of cyclo-static real-time systems is the determination of buffer capacities. In our multi-processor system, we apply back-pressure, which means that tasks...